汽車微處理器下底盒注塑模設計
汽車微處理器下底盒注塑模設計,汽車,微處理器,下底盒,注塑,設計
目 錄
摘要
前言····································································································································(1)
第一章 塑料制件的設計···································································································(3)
1.1 塑件材料的性能··································································································(3)
1.2 塑件的體積與重量······························································································(5)
1.3 塑件工藝分析及結(jié)構(gòu)設計··················································································(6)
第二章 總體設計方案的確定··························································································(8)
2.1 分型面的選擇·······································································································(8)
2.2 排氣方式的確定···································································································(8)
2.3 型腔數(shù)目和排列方式的確定···············································································(9)
2.4 注塑機的選擇·······································································································(9)
第三章 澆注系統(tǒng)的設計及計算······················································································(11)
3.1 流道設計············································································································(11)
3.2 澆口設計············································································································(11)
3.3 流動比校核········································································································(12)
第四章 成型零件設計·····································································································(13)
4.1 成型零件結(jié)構(gòu)設計····························································································(13)
4.2 成型零件工作尺寸計算····················································································(13)
4.3 成型零件的力學計算························································································(18)
第五章 導向與定位機構(gòu)設計·························································································(21)
5.1 導向機構(gòu)的設計································································································(21)
5.2 定位機構(gòu)設計····································································································(22)
第六章 脫模機構(gòu)設計···································································································(23)
6.1 脫模力的計算····································································································(23)
6.2 推出機構(gòu)形式的確定························································································(24)
6.3 推出零件尺寸的確定························································································(24)
第七章 側(cè)向分型與抽芯機構(gòu)設計···············································································(28)
7.1 側(cè)向分型和抽芯機構(gòu)的類型············································································(29)
7.2 抽拔距的確定····································································································(30)
7.3 抽拔力的計算····································································································(32)
7.4 斜導柱的設計····································································································(32)
7.5 滑塊與導滑槽設計····························································································(33)
7.6 楔緊塊的設計····································································································(33)
第八章 溫度調(diào)節(jié)系統(tǒng)的設計·························································································(33)
8.1 求塑件在固化時每小時釋放的熱量Q····························································(33)
8.2 求冷卻水的體積流量························································································(34)
第九章 標準模架的選用··································································································(35)
第十章 注塑機參數(shù)校核··································································································(35)
10.1 最大注塑量校核······························································································(35)
10.2 鎖模力校核······································································································(36)
10.3 模具與注塑機安裝部分相關(guān)尺寸校核··························································(36)
10.4 開模行程校核··································································································(37)
第十一章 模具裝配與試?!ぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぃ?8)
11.1 模具的裝配·······································································································(38)
11.2 模具的安裝·······································································································(39)
11.3 試?!ぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぁぃ?9)
畢業(yè)設計總結(jié)····················································································································(40)
后記···································································································································(41)
參考文獻···························································································································(42)
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編號:2350894
類型:共享資源
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格式:RAR
上傳時間:2019-11-21
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積分
- 關(guān) 鍵 詞:
-
汽車
微處理器
下底盒
注塑
設計
- 資源描述:
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汽車微處理器下底盒注塑模設計,汽車,微處理器,下底盒,注塑,設計
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